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FO-WLP : Fan Out Wafer Level Package
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SFA Semicon

Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing

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Manufacturer
SFA Semicon
Brand
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SKU
35727
Product Name
FO-WLP : Fan Out Wafer Level Package
Model Name
-
Size
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Weight
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Product Details

Description

On a semiconductor chip after RDL.
Fan-out structure : Some of solder balls are attached to a substrate outside of a semiconductor chip after RDL.
The process of molding the molding compound resin should be performed for Re-distribution layer which is expanded outside of chip. Additional processes for molded layer requires and turn around time is increased. The fan-out package with EMC is consequently warped due to big CTE difference after molding and package crack is generated at the interface among four different materials (Passivation, EMC Cu and Die)

 

Application

ㆍMobile phones (highest volume application)

ㆍDigital cameras and camcorders

ㆍMP3 players / Watch modules

ㆍLaptop and tablet computers / Medical

ㆍAutomotive

ㆍWearable electronics

 

Feature

ㆍReduction of TAT time with skipping WSS process.

ㆍMFG cost down & warpage improvement through using low cure polymer

ㆍNo EMC resin particle issue at sputtering process

ㆍImproved lithography techniques to compensate die shift generated at die mount process

ㆍHigh reliability performance of large sized FO-WLP

SFA Semicon
Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
SFA Semicon is a leading independent assembly and test service provider offering full turnkey solutions from wafer bumping, assembly and testing through drop-shipment with wide range of package solutions and advanced technology and high quality of engineering and manufacturing services. SFA Semicon is also the world’s leading manufacturing service provider of advanced memory card (storage) products. SFA Semicon, Korea-based largest assembly and test service provider, has been expanding our ability to provide the service globally through China and Philippines plants and is enabling customers to delivery most competitive prices, high level quality management and core strengths in research and development (R&D), design and sales marketing. Based on our semcondutor manfacturing capabilities, high level of production quality control and customer support, we are expanding our business engagement to top global semicondutor companies and helping them a success. SFA Semicon is fully committed to support the best satisfaction and value creation of shareholders, customers and employees and improvement of corporate sustainability and management system. SFA Semicon will continue our efforts to provide most advanced leading technology, high quality control, customer service and growth of company, which will return of good profit to the stockholders and employees. We appreciate all your warm support and attention for the success of SFA Semicon.
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