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Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
Description
FBGA packages have been assembled for years in SFA SEMICON . SFA SEMICON 's experienced design group provides the best package structure design and cost-effective material choices to achieve low profile, small form factor, high reliability and high-quality electrical/ thermal performance for FBGA. BGA technology was first introduced as a solution to problems associated with the increasingly high lead counts required for advanced semiconductors used in applications such as portable computers and wireless telecommunications. As the number of leads surrounding the integrated circuits increased, high lead count packages experienced significant electrical shorting problems. BGA technology solved this problem by effectively creating leads on the bottom surface of the package in the form of small bumps or solder balls.
Application
ㆍHand-held consumer products
ㆍComputing platforms, Networking
ㆍWireless Communications devices
ㆍPersonal Digital Asistants
Feature
ㆍFace-up/Face-down
ㆍJEDEC Standard compliance
ㆍMCP / SiP / Flip chip
ㆍGreen materials (Pb-free / RoHS compliance)
ㆍBall pitch ≥ 0.40mm