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FBGA : Fine-pitch Ball Grid Array
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FBGA : Fine‐pitch Ball Grid Array
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SFA Semicon

Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing

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Manufacturer
SFA Semicon
Brand
-
SKU
35731
Product Name
FBGA : Fine-pitch Ball Grid Array
Model Name
-
Size
-
Weight
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Product Details

Description

FBGA packages have been assembled for years in SFA SEMICON . SFA SEMICON 's experienced design group provides the best package structure design and cost-effective material choices to achieve low profile, small form factor, high reliability and high-quality electrical/ thermal performance for FBGA. BGA technology was first introduced as a solution to problems associated with the increasingly high lead counts required for advanced semiconductors used in applications such as portable computers and wireless telecommunications. As the number of leads surrounding the integrated circuits increased, high lead count packages experienced significant electrical shorting problems. BGA technology solved this problem by effectively creating leads on the bottom surface of the package in the form of small bumps or solder balls.

 

Application

ㆍHand-held consumer products

ㆍComputing platforms, Networking

ㆍWireless Communications devices

ㆍPersonal Digital Asistants

 

Feature

ㆍFace-up/Face-down

ㆍJEDEC Standard compliance

ㆍMCP / SiP / Flip chip

ㆍGreen materials (Pb-free / RoHS compliance)

ㆍBall pitch ≥ 0.40mm

SFA Semicon
Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
SFA Semicon is a leading independent assembly and test service provider offering full turnkey solutions from wafer bumping, assembly and testing through drop-shipment with wide range of package solutions and advanced technology and high quality of engineering and manufacturing services. SFA Semicon is also the world’s leading manufacturing service provider of advanced memory card (storage) products. SFA Semicon, Korea-based largest assembly and test service provider, has been expanding our ability to provide the service globally through China and Philippines plants and is enabling customers to delivery most competitive prices, high level quality management and core strengths in research and development (R&D), design and sales marketing. Based on our semcondutor manfacturing capabilities, high level of production quality control and customer support, we are expanding our business engagement to top global semicondutor companies and helping them a success. SFA Semicon is fully committed to support the best satisfaction and value creation of shareholders, customers and employees and improvement of corporate sustainability and management system. SFA Semicon will continue our efforts to provide most advanced leading technology, high quality control, customer service and growth of company, which will return of good profit to the stockholders and employees. We appreciate all your warm support and attention for the success of SFA Semicon.
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