Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
Description
SIP package containing combination of one or more multifunctional Ics with heterogeneous interconnection Including passive components and MEMS/Sensor assembled into a single package EMI shielding with sputtering and plating. Any combination of one or more integrated circuit(s) of different functionalities with various form and factors passive components and/or MEMS assembled into a single package. Getting all or part of the functions of an electronic system on the standard PCB board for a moniturization Achieving electrical/thermal performance enhancement purposes
Application
ㆍPower amplifiers, Antenna switches/Frontend module & transceiver, Connectivity module, MEMS integration with ASIC, Sensory module, automotive, 3G/4G model, Solid-state storage devices(SSD)
Feature
ㆍPassive Component (≥ 01005)
ㆍSAW,BAW filter, X-tal, Oscillator, Antenna
ㆍEPS (Embedded Passive Substrate)
ㆍEAD (Embedded Active Device)
ㆍCore & Coreless Substrate
ㆍMold Grinding / Double Molding
ㆍShielding