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Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
Description
PBGA is a die-up design, plastic overmolded BGA using 2, 4 or 6 layer BT substrate and 1.0 or 1.27mm ball pitch and above. It offers high a I/O replacement for the QFP package when the I/O exceeds QFP-256 limitations. SFA SEMICON's PBGA offers improved electrical and thermal operation through multiple routing layers such as ground and power planes. Additionally, industry proven processes and materials provide assurance for reliable and long-term operation.
Application
ㆍMicroprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets
ㆍwireless telecommunications, GPS, laptop PC’s, video cameras, disc drives, PLDs, graphics
Feature
ㆍJEDEC Standard compliance
ㆍMCP / SiP / Flip chip
ㆍGreen materials (Pb-free / RoHS compliance)