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Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
Description
SFA SEMICON’s Quad Flat Pack (QFP) is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The QFP is targeted at cost sensitive applications while providing a high degree of thermal and electrical performance. Offered in a wide range of body sizes and pin counts, the QFP provides designers with the flexibility and convenience of meeting their packaging needs for a large variety of device designs.
Application
ㆍProcessor, Controller, DSP, ASIC
ㆍVideo-DAC, PC Chip-Sets
ㆍGate Array
ㆍLogic, Multimedia
ㆍHome Appliances,
ㆍCommercial Commodity
ㆍAutomotive
Feature
ㆍJEDEC Standard compliance
ㆍDie stack Applicable
ㆍGreen materials (Pb-free / RoHS compliance)
ㆍLead pitch ≥ 0.65mm