자동차 설비, 초정밀 용접설비, 측정검사설비 개발, 전자총 생산설비 제공
This equipment deposits Indium Thin Oxide onto the parts’ surface by incorporating the Sputter & Thermal Heater method and is intended for Pattern Nb2o5/SiO2/ITO Plating of the G1F & G2 method implemented Touch Screen Panel in Smart Phones and Tablet PCs.
Features |
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1 |
High |
User Friendly |
1. Rotative & Orbital Load/Unloading |
Production Capacity |
1,080ea/1Hr, 4” based |
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2 |
Low |
Temp |
100˚↓ |
Operating Cost |
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Coefficient Of Friction |
Specification |
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Works Space |
L4500*D6500*H2700 |
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Weight |
4.5 Tons |
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Main |
Chamber |
Φ1,600*H1600 |
Source |
Sputter+ Thermal Heater |
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Work Jig |
Φ125 * 28 Axis |
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Pump |
Diffusion Pump |
20” 1 Set |
Rotary & Booster Pump |
gxs250 & EH2600 |
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Vacuum Level |
5*10-5torr |
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Option |
Chiller |
20RT |
Poly Coldp |
100,000L/Sec |
Comparison |
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Wise AF-1600 PeCVD ( Φ1,600 ) |
EIn Line Type |
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Capa |
Batch Time |
60min |
Long |
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Glass Size |
4” |
7” |
10.1” |
Optimized |
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1 Batch |
1,080 |
320 |
192 |
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Day [22Hr] |
35,640 |
10,560 |
6,336 |
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Month [26Day] |
926,640 |
274,560 |
164,736 |
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Deposition Temp |
100~150℃ |
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Target |
Rotative & Orbital Magazine 12ea |
Titanium Carrier |