제조사 / 판매자 | (주)에스에프에이반도체[바로가기] |
---|---|
연락처 | 041-520-6400 |
브랜드 | - |
제품코드 | 35732 (제품 정보 수정 및 삭제 요청시 필요) |
제품명 | Fine-pitch Ball Grid Array Stack Die |
모델명 | - |
사이즈 | - |
중량 | - |
주의사항 | 아래는 참고용 정보이므로 세부 조건은 반드시 제조사/판매자에게 문의 바랍니다. |
Description
The electronics market trend is to offer more functionality, better performance, higher density, lower cost, along with smaller footprints and lower profiles. SFA SEMICON's Stacked die packages are continuously being upgraded to meet these demands. Compared to single die packages, the stacked die package combines with several different functional devices, or increases memory density within same footprints as a single die package. In addition, this package can be built either as a Land Grid Array or Ball Grid Array to match the application or thermal/electrical design requirements.
Application
ㆍMobile Phone, PDA, Camcorder, Wireless Home Appliances
Feature
ㆍFace-up
ㆍJEDEC Standard compliance
ㆍMCP / SiP
ㆍGreen materials (Pb-free / RoHS compliance)
ㆍBall pitch ≥ 0.40mm