개요
300mm Wafer의 Post CMP Clean, PR Strip, Ashingless PR Strip, Metal 제거 공정애 대응 가능한 매엽식 세정설비
특징
Process Performance
- High Temperature SPM Process over 150℃
- PR Strip, Post CMP Clean, Metal Clean and etc.
Productivity / Hardware
- Contamination Free Clean by NIC Bowl
- H2SO4 Recycle System
- Energy Efficiency Rating : Class 1