Information
25 Daehak 4-ro, Yeongtong-gu, Suwon, Gyeonggi-do, South Korea
+82 31-212-1985
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Overview
- Summary
- ASICLAND Co., Ltd. is a specialized company in Application-Specific Integrated Circuit (ASIC) design services and System-on-Chip (SoC) product development. It stands as the sole domestic VCA (Value Chain Alliance) partner of TSMC and an ADP (Approved Design Partner) of Arm, providing total turnkey solutions based on advanced process technologies. The company focuses on developing and supplying high-performance SoC solutions for key Fourth Industrial Revolution sectors such as AI, IoT, 5G, and high-performance computing. ASICLAND offers end-to-end services, encompassing the entire semiconductor production process from customized chip design to mass production.ASICLAND Co., Ltd. is a specialized company in Application-Specific Integrated Circuit (ASIC) design services and System-on-Chip (SoC) product development. It stands as the sole domestic VCA (Value Chain Alliance) partner of TSMC and an ADP (Approved Design Partner) of Arm, providing total turnkey solutions based on advanced process technologies. The company focuses on developing and supplying high-performance SoC solutions for key Fourth Industrial Revolution sectors such as AI, IoT, 5G, and high-performance computing. ASICLAND offers end-to-end services, encompassing the entire semiconductor production process from customized chip design to mass production.
- Key Products/Technologies
- Application-Specific Integrated Circuit (ASIC) Design Services and System-on-Chip (SoC) Product Development: Providing total turnkey services covering all stages of semiconductor production, including Spec-In, Front-end/Back-end, Package, Test, and Product delivery.Application-Specific Integrated Circuit (ASIC) Design Services and System-on-Chip (SoC) Product Development: Providing total turnkey services covering all stages of semiconductor production, including Spec-In, Front-end/Back-end, Package, Test, and Product delivery.
- Advanced Process Design Capabilities: Supporting a vast spectrum of technologies from 0.25µm to 3nm, with successful execution of numerous high-technology projects in 5nm, 7nm, 12nm, 16nm, and 28nm processes. Actively securing and investing in 2nm and 3nm ultra-fine process design capabilities.Advanced Process Design Capabilities: Supporting a vast spectrum of technologies from 0.25µm to 3nm, with successful execution of numerous high-technology projects in 5nm, 7nm, 12nm, 16nm, and 28nm processes. Actively securing and investing in 2nm and 3nm ultra-fine process design capabilities.
- Advanced Packaging Technologies: Developing new packaging technologies utilizing silicon bridges to improve TSMC's CoWoS (Chip-on-Wafer-on-Substrate) technology. Offering advanced packaging design and analysis, including 2.5D and 3D, along with signal integrity and power integrity analysis services.Advanced Packaging Technologies: Developing new packaging technologies utilizing silicon bridges to improve TSMC's CoWoS (Chip-on-Wafer-on-Substrate) technology. Offering advanced packaging design and analysis, including 2.5D and 3D, along with signal integrity and power integrity analysis services.
- AI/ML Accelerator and Neuromorphic AI Processor Design: Providing architectural support, RTL implementation, verification, and validation for low-power, high-performance AI and machine learning silicon. Participation in the development project for BrainChip's second-generation neuromorphic AI processor, 'AKD2500'.AI/ML Accelerator and Neuromorphic AI Processor Design: Providing architectural support, RTL implementation, verification, and validation for low-power, high-performance AI and machine learning silicon. Participation in the development project for BrainChip's second-generation neuromorphic AI processor, 'AKD2500'.
- Chiplet-based Next-Generation Platform Development: Commencing full-scale development of chiplet-based platforms for long-term high-margin policy realization. Possessing IP licensing and integration capabilities for UCIe, LPDDR5, PCIE5/6.Chiplet-based Next-Generation Platform Development: Commencing full-scale development of chiplet-based platforms for long-term high-margin policy realization. Possessing IP licensing and integration capabilities for UCIe, LPDDR5, PCIE5/6.
- Diverse SoC Solutions: Offering semiconductor design and verification services across various industries, including networking and communication, healthcare, mobile devices, automotive, and consumer electronics.Diverse SoC Solutions: Offering semiconductor design and verification services across various industries, including networking and communication, healthcare, mobile devices, automotive, and consumer electronics.
- Core Advantages
- Exclusive TSMC VCA Partnership: As the sole official partner of the world's leading foundry TSMC, the company holds exclusive access to and deep understanding of TSMC's latest foundry processes and advanced packaging technologies.Exclusive TSMC VCA Partnership: As the sole official partner of the world's leading foundry TSMC, the company holds exclusive access to and deep understanding of TSMC's latest foundry processes and advanced packaging technologies.
- Arm Total Design and Approved Design Partner Status: As an official partner of Arm, the global leading semiconductor IP company, it has a robust support system and technical expertise for Arm-based solution development.Arm Total Design and Approved Design Partner Status: As an official partner of Arm, the global leading semiconductor IP company, it has a robust support system and technical expertise for Arm-based solution development.
- Leadership in Ultra-Fine Process and Advanced Packaging Technology: Securing technological superiority through the internalization and development of cutting-edge process design capabilities (2nm, 3nm) and advanced packaging technologies (CoWoS, 2.5D, 3D).Leadership in Ultra-Fine Process and Advanced Packaging Technology: Securing technological superiority through the internalization and development of cutting-edge process design capabilities (2nm, 3nm) and advanced packaging technologies (CoWoS, 2.5D, 3D).
- Comprehensive Turnkey Service Provision: Offering a turnkey solution for the entire semiconductor production process, from Spec-In to design, front-end, back-end, test, and mass production, thereby reducing customer development risks and accelerating time-to-market.Comprehensive Turnkey Service Provision: Offering a turnkey solution for the entire semiconductor production process, from Spec-In to design, front-end, back-end, test, and mass production, thereby reducing customer development risks and accelerating time-to-market.
- Specialization in AI Semiconductors and High Revenue Contribution: Demonstrating strong capabilities in AI semiconductors with a high revenue proportion (48% in 2023, approximately 54% in 2024) and advanced AI semiconductor technologies such as ASICs for AI data centers and neuromorphic AI processors.Specialization in AI Semiconductors and High Revenue Contribution: Demonstrating strong capabilities in AI semiconductors with a high revenue proportion (48% in 2023, approximately 54% in 2024) and advanced AI semiconductor technologies such as ASICs for AI data centers and neuromorphic AI processors.
- Global Market Expansion Strategy: Establishing a Taiwan R&D center for advanced technology acquisition and Asian market expansion, alongside accelerating entry into the North American market through collaborations like with BrainChip in the US.Global Market Expansion Strategy: Establishing a Taiwan R&D center for advanced technology acquisition and Asian market expansion, alongside accelerating entry into the North American market through collaborations like with BrainChip in the US.
- Target Industrie
- Artificial Intelligence (AI) and Machine Learning (ML) Accelerators: Targeting the AI semiconductor market where high performance and power efficiency are crucial.Artificial Intelligence (AI) and Machine Learning (ML) Accelerators: Targeting the AI semiconductor market where high performance and power efficiency are crucial.
- High-Performance Computing (HPC) and Data Centers: Developing ASICs (eSSD, CXL related) for large-scale storage solutions and AI HPC server chiplet designs.High-Performance Computing (HPC) and Data Centers: Developing ASICs (eSSD, CXL related) for large-scale storage solutions and AI HPC server chiplet designs.
- Networking and Communication: Providing robust silicon design and verification for high-speed connectivity, data centers, and telecom infrastructure.Networking and Communication: Providing robust silicon design and verification for high-speed connectivity, data centers, and telecom infrastructure.
- Automotive: Delivering functional-safety-aware semiconductor solutions for connected and autonomous vehicles.Automotive: Delivering functional-safety-aware semiconductor solutions for connected and autonomous vehicles.
- Internet of Things (IoT) and 5G: Offering SoC solutions for various IoT devices and 5G communication systems.Internet of Things (IoT) and 5G: Offering SoC solutions for various IoT devices and 5G communication systems.
- Mobile Devices and Consumer Electronics: Specializing in power-efficient, high-performance silicon engineering for smartphones, tablets, wearables, and general consumer electronics.Mobile Devices and Consumer Electronics: Specializing in power-efficient, high-performance silicon engineering for smartphones, tablets, wearables, and general consumer electronics.
- Healthcare: Supplying precision semiconductor solutions for medical-grade devices and diagnostic hardware.Healthcare: Supplying precision semiconductor solutions for medical-grade devices and diagnostic hardware.
- Robotics and Mobility: Pursuing verification and commercialization of domestic AI semiconductors in collaboration with Daegu City.Robotics and Mobility: Pursuing verification and commercialization of domestic AI semiconductors in collaboration with Daegu City.
- Major Markets
- South Korea (Headquarters and domestic market), Taiwan (Establishment of R&D center, foundry collaboration, attraction of local fabless customers, mass production orders for home appliances), Malaysia (Strategic cooperation and pursuit of new projects), Southeast Asia (Market expansion including Malaysia)South Korea (Headquarters and domestic market), Taiwan (Establishment of R&D center, foundry collaboration, attraction of local fabless customers, mass production orders for home appliances), Malaysia (Strategic cooperation and pursuit of new projects), Southeast Asia (Market expansion including Malaysia)
- United States (Market entry preparation, AI processor development collaboration with BrainChip)United States (Market entry preparation, AI processor development collaboration with BrainChip)
- Certifications/Patents
- TSMC Value Chain Alliance (VCA) Partner: Status as the sole official TSMC partner in Korea, designated in 2019.TSMC Value Chain Alliance (VCA) Partner: Status as the sole official TSMC partner in Korea, designated in 2019.
- Arm Approved Design Partner (ADP) and Arm Total Design Partner: Official certification and partnership for Arm-based solution development and design.Arm Approved Design Partner (ADP) and Arm Total Design Partner: Official certification and partnership for Arm-based solution development and design.
- Minister of Trade, Industry and Energy Commendation: Awarded to Executive Director Kim Jun-ho at the '18th Semiconductor Day' ceremony for contributions to the growth and expansion of the domestic system semiconductor industry.Minister of Trade, Industry and Energy Commendation: Awarded to Executive Director Kim Jun-ho at the '18th Semiconductor Day' ceremony for contributions to the growth and expansion of the domestic system semiconductor industry.
- Proprietary Technologies: Possession of numerous core technologies, including AI semiconductor-related patents, AI processor-related technologies, and CPU subsystem automation platforms.Proprietary Technologies: Possession of numerous core technologies, including AI semiconductor-related patents, AI processor-related technologies, and CPU subsystem automation platforms.
- Successful Development and Mass Production of 5G Millimeter-Wave (mmWave) Chips: A track record of successfully securing and mass-producing the world's first 5G mmWave chip development project from a domestic client.Successful Development and Mass Production of 5G Millimeter-Wave (mmWave) Chips: A track record of successfully securing and mass-producing the world's first 5G mmWave chip development project from a domestic client.
- Ultra-Fine Process and Advanced Packaging Technology Capabilities: Technical competitiveness secured through 2nm and 3nm ultra-fine process design and the acquisition of expert engineers in CoWoS packaging technology.Ultra-Fine Process and Advanced Packaging Technology Capabilities: Technical competitiveness secured through 2nm and 3nm ultra-fine process design and the acquisition of expert engineers in CoWoS packaging technology.
Introduction
Location
25 Daehak 4-ro, Yeongtong-gu, Suwon, Gyeonggi-do, South Korea
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