Semi conductor equipment manufacturer, Aero space equipment, Parts, Measuring equipment, UV curling machine, Lamp and more
Vacuum Laminator
The equipment that install NCF on the Wafer without damage of Void, Thermal Strain, and Bump in 3D TSV Packaging processing and It also laminates film using by diaphragm expansion that is caused by air pressure difference in Vacuum Chamber.
Product descriptions
SPECIFICATION
· TYPE : FULL AUTO BUMPED
· WAFER SIZE(inch)
: 8”, 12” Wafer
: 8”, 12” Wafer(With Ring Frame)
· DEMENSION(mm) : 1,990(W) * 2,580(D) * 2,220(H)
· WEIGHT : 1,100kg