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Auto BG Laminator
The system is for laminating protection tape to the side of wafer pattern before Wafer Back Grinding Processing.
Product descriptions
SPECIFICATION
· TYPE : FULL AUTO THIN
· WAFER SIZE(inch) : 6”, 8”, 12”
· DEMENSION(mm) : 1,520(W) * 1,400(D) * 1,900(H)
· WEIGHT : 800kg