This product is manufactured by
EO TECHNICS
Manufacturer information
EO TECHNICS
Laser processing equipment manufacturer, Laser marking M/C for semi conductor, Driller, PCB via hole and more
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Manufacturer
EO TECHNICS
Brand
-
SKU
30409
Product Name
Grooving & Dicing Equipment
Model Name
LMC3200
Size
-
Weight
-
Product Details
Grooving & Dicing
- LMC3200G with DPSS laser removes the low-k and metal layer which lower the yield rate on the saw blade process.
It improves the quality and productivity of the singulation process.
- LMC3200D is a system for thin wafer dicing.
It is better than mechanical blade type; It doesn’t need to replace blade and reduces wafer chipping in the processing.
Laser processing equipment manufacturer, Laser marking M/C for semi conductor, Driller, PCB via hole and more
EO TECHNICS, Total Laser Specialist
EO TECHNICS is a total laser company in the field of semiconductor, display, PCB and macro. We are manufacturing the laser processing equipment. EO TECHNICS is a leader of laser marking industry. We also supply top-quality laser solutions for cutting, drilling, patterning, grooving, and welding. We will make forays into all areas of the laser industry and become a global total laser solution provider.
Eco-friendly & Future – oriented Technologies
Laser processing technology is a new paradigm of the IT industry. It has enabled super-precision processing which is impossible with the traditional processing methods. The laser processing technology can solve environmental pollution problems caused by chemicals. The laser technology is being more widely applied to various industries such as automobile machine parts due to the emergence of the Internet of Things.