Laser processing equipment manufacturer, Laser marking M/C for semi conductor, Driller, PCB via hole and more
Laser lift-off separates carrier glass and flexible panel, which is essential for the flexible display process.
The equipment provides customized solution with the best high power laser.
Chamfer-cut cuts a conner of a panel, which is essential for the flexible display process.
It can prevent cracks at the corner of material.
Green laser annealing laser system uses in the process of transforming a-si to LTPS.
It is cost- effective and low-maintenance compared to the gas laser equipment.