FNS TECH, established in 2002, is a specialized company in display equipment, initially focusing on TFT-LCD equipment and now producing OLED manufacturing process equipment. The company continuously expands its business into core components and materials for the semiconductor and display industries through ongoing R&D, establishing a stable business portfolio. Its main products include display wet process equipment and semiconductor-grade CMP PADs, UV LAMPS, and OLED component cleaning materials. Recently, the company accelerated its entry into the global semiconductor market through the acquisition of a Taiwanese semiconductor component manufacturer.FNSTECH,establishedin2002,isaspecializedcompanyindisplayequipment,initiallyfocusingonTFT-LCDequipmentandnowproducingOLEDmanufacturingprocessequipment.ThecompanycontinuouslyexpandsitsbusinessintocorecomponentsandmaterialsforthesemiconductoranddisplayindustriesthroughongoingR&D,establishingastablebusinessportfolio.Itsmainproductsincludedisplaywetprocessequipmentandsemiconductor-gradeCMPPADs,UVLAMPS,andOLEDcomponentcleaningmaterials.Recently,thecompanyaccelerateditsentryintotheglobalsemiconductormarketthroughtheacquisitionofaTaiwanesesemiconductorcomponentmanufacturer.
Key Products/TechnologiesKeyProducts/Technologies
Display Manufacturing Equipment: Production capabilities for OLED manufacturing wet process equipment, including Cleaners, Strippers, Etchers, Developers, and Metal Mask Cleaners.DisplayManufacturingEquipment:ProductioncapabilitiesforOLEDmanufacturingwetprocessequipment,includingCleaners,Strippers,Etchers,Developers,andMetalMaskCleaners.
CMP PAD: Ownership of Chemical Mechanical Polishing (CMP) pads for semiconductor processes and recycled polishing pad technology.CMPPAD:OwnershipofChemicalMechanicalPolishing(CMP)padsforsemiconductorprocessesandrecycledpolishingpadtechnology.
UV LAMP: Supply of TOC oxidation devices and UV lamps for ultrapure water processes, essential in semiconductor and display industries.UVLAMP:SupplyofTOCoxidationdevicesandUVlampsforultrapurewaterprocesses,essentialinsemiconductoranddisplayindustries.
OLED MASK: Business in OLED component cleaning and OLED mask manufacturing technology.OLEDMASK:BusinessinOLEDcomponentcleaningandOLEDmaskmanufacturingtechnology.
Release Film: An innovative material with various properties such as heat resistance, slip resistance, and waterproofing, used in diverse industrial fields.ReleaseFilm:Aninnovativematerialwithvariouspropertiessuchasheatresistance,slipresistance,andwaterproofing,usedindiverseindustrialfields.
Release Paper: A product providing uniform and excellent release properties through silicone release treatment on paper substrates with PE extrusion coating or special coating.ReleasePaper:AproductprovidinguniformandexcellentreleasepropertiesthroughsiliconereleasetreatmentonpapersubstrateswithPEextrusioncoatingorspecialcoating.
Glass Substrate Etching Core Technology: Possession of core technology related to flat panel display glass substrate etching devices and patent applications in Korea and abroad.GlassSubstrateEtchingCoreTechnology:PossessionofcoretechnologyrelatedtoflatpaneldisplayglasssubstrateetchingdevicesandpatentapplicationsinKoreaandabroad.
Core AdvantagesCoreAdvantages
Business Portfolio Diversification: Expansion from TFT-LCD equipment to OLED process equipment, and further into semiconductor and display component/material businesses, establishing a stable business structure.BusinessPortfolioDiversification:ExpansionfromTFT-LCDequipmenttoOLEDprocessequipment,andfurtherintosemiconductoranddisplaycomponent/materialbusinesses,establishingastablebusinessstructure.
Localization Capability for Core Components and Materials: Successful localization of key semiconductor and display components like CMP PADs and UV LAMPS, ensuring technological independence and cost competitiveness.LocalizationCapabilityforCoreComponentsandMaterials:SuccessfullocalizationofkeysemiconductoranddisplaycomponentslikeCMPPADsandUVLAMPS,ensuringtechnologicalindependenceandcostcompetitiveness.
Expanded Global Customer Network: Diversification of customer base to global semiconductor companies such as TSMC, Applied Materials, Micron, and SK Hynix through the acquisition of Taiwanese Asahi Lamp, strengthening international market penetration.ExpandedGlobalCustomerNetwork:DiversificationofcustomerbasetoglobalsemiconductorcompaniessuchasTSMC,AppliedMaterials,Micron,andSKHynixthroughtheacquisitionofTaiwaneseAsahiLamp,strengtheninginternationalmarketpenetration.
Increased Proportion of High-Profit Component Business: Growing sales proportion of high-margin products like halogen lamps and CMP pads, driving overall profitability improvement.IncreasedProportionofHigh-ProfitComponentBusiness:Growingsalesproportionofhigh-marginproductslikehalogenlampsandCMPpads,drivingoverallprofitabilityimprovement.
Proactive Pursuit of Next-Generation Technologies: Development of HBM process CMP pads and new glass substrate businesses (materials + equipment), securing future growth engines.ProactivePursuitofNext-GenerationTechnologies:DevelopmentofHBMprocessCMPpadsandnewglasssubstratebusinesses(materials+equipment),securingfuturegrowthengines.
Reliability Based on Unique Technology and Quality: Continuous product quality improvement through proprietary technology and thorough process control, building customer trust.ReliabilityBasedonUniqueTechnologyandQuality:Continuousproductqualityimprovementthroughproprietarytechnologyandthoroughprocesscontrol,buildingcustomertrust.
Target IndustrieTargetIndustrie
Display Industry (TFT-LCD, OLED manufacturing processes)DisplayIndustry(TFT-LCD,OLEDmanufacturingprocesses)
Semiconductor Industry (wafer polishing, ultrapure water treatment, Rapid Thermal Processing (RTP), Epitaxial Deposition (EPI) processes)SemiconductorIndustry(waferpolishing,ultrapurewatertreatment,RapidThermalProcessing(RTP),EpitaxialDeposition(EPI)processes)
Automotive Parts Industry (replacement parts)AutomotivePartsIndustry(replacementparts)
Major MarketsMajorMarkets
South Korea, Taiwan (semiconductor market entry point via Asahi Lamp acquisition), China (glass substrate etching device patent application), Japan (glass substrate etching device patent application)SouthKorea,Taiwan(semiconductormarketentrypointviaAsahiLampacquisition),China(glasssubstrateetchingdevicepatentapplication),Japan(glasssubstrateetchingdevicepatentapplication)
United States (recycled polishing pad patent acquisition and securing customers like Applied Materials)UnitedStates(recycledpolishingpadpatentacquisitionandsecuringcustomerslikeAppliedMaterials)
Certifications/PatentsCertifications/Patents
US patent acquisition for Recycled Polishing PadUSpatentacquisitionforRecycledPolishingPad
Possession of 48 domestic registered patents, 2 utility models, and 1 design patentPossessionof48domesticregisteredpatents,2utilitymodels,and1designpatent
Patent registration for process sheet for flexible circuit boards and its manufacturing methodPatentregistrationforprocesssheetforflexiblecircuitboardsanditsmanufacturingmethod
Patent registration for non-silicone process sheet including an antistatic primer layer and its manufacturing methodPatentregistrationfornon-siliconeprocesssheetincludinganantistaticprimerlayeranditsmanufacturingmethod
Patent applications in China and Japan related to flat panel display glass substrate etching devicesPatentapplicationsinChinaandJapanrelatedtoflatpaneldisplayglasssubstrateetchingdevices
ISO9001:2015 Quality Management System certificationISO9001:2015QualityManagementSystemcertification
INNOBIZ certification (Technology Innovation Small and Medium Business)INNOBIZcertification(TechnologyInnovationSmallandMediumBusiness)
Root Company certificationRootCompanycertification
Material, Parts, and Equipment Specialist Company certificationMaterial,Parts,andEquipmentSpecialistCompanycertification
Automotive replacement parts certifications (BMW 5-series rear bumper cover, KIA K3(BD) front bumper cover)Automotivereplacementpartscertifications(BMW5-seriesrearbumpercover,KIAK3(BD)frontbumpercover)
Introduction
Location
19 4sandan 2-gil, Jiksan-eup, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea
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Information
19 4sandan 2-gil, Jiksan-eup, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea