Our company, iWinPlus, was established in 2003 as a specialized company that provides CSP (Chip Scale Package) packaging services for image sensors based on the patented original technology of the trademark 'NeoPAC®'.
The main patent technology used in NeoPAC® manufacturing is based on Fluxless soldering flip chip bonding and TLP bonding Closed loop sealing, SBL (Stress Buffer Layer) and extended SBL structure based on it are all the best technologies in the world.
NeoPAC® offers the world's best slim competitive edge compared to competitive technology, small size, and reliability and quality We are receiving it and are proud to have excellent price competitiveness by using Wafer-Level Packaging (WLP) technology, which is suitable for mass production.