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Koh Young Technology

3D measurement & inspection equipment manufacturer, Solution, Solder paste inspection machine, SMT, 3D SPI equipment and more

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Manufacturer
Koh Young Technology
Brand
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SKU
34685
Product Name
Meister
Model Name
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Product Details

World-Best Advanced IC Packaging Inspection

· The world's most advanced IC packaging process optimization solution
- Industry leading measurement accuracy and inspection reliability
- Provides high-resolution review
- Applicable packaging: SiP, 2.5D, 3D, 3D WLP, WL CSP, FO WLP, FC BGA, MCM
- Handling media: Laminate Substrate, Metal Carrier, Strip on Boat, Mylar Frame

· Full 3D data-based process optimization solution: Realization of industry 4.0 / smart factory
- Real-time process optimization through powerful SPC analytics
- Efficient process management through convenient software

Koh Young Technology
3D measurement & inspection equipment manufacturer, Solution, Solder paste inspection machine, SMT, 3D SPI equipment and more
Koh Young Technology is a market-proven technology leader using the best optomechatronics and machine vision technologies. Founded in 2002, Koh Young has paved the way for true smart factory solutions with its 3D measurement-based inspection solutions to overcome all types of inspection challenges. Koh Young is also contributing to the revolution in the medical field using its expertise in innovative optomechatronics. The company’s corporate headquarters and manufacturing location is based in South Korea with R&D facilities focusing on artificial intelligence and deep learning across the globe. Along with a global network of sales and service centers, Koh Young Technology aims to respond swiftly to your needs and to deliver the highest level of customer satisfaction.
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