Features
· High reliability proved in various of industry field
· Optimized screw rotor and shorter gas pass
· Water cooled type motor
- Adopted Water cooled type motor and solved the main problem of air cooled type motor which had noise and solved the problem of flying the dust in all directions well.
· Easy to move and work
- Easy to move and work with portable type
- Easy to operate with the separation type of control panel, easy to stick to the controller on all positions and available to operate on the remote.
· Soundproofing panel
- Available to use indoors by reducing the noise and adopting the visual design panel.
- Certified quality and reliability in the field of flat display and semi-conductor
· Small and economical vacuum pump
· Small Footprint and easy operation
· Improved displacement
Advantages to the Users
Available to choose the suitable pump from the range (50 ～ 5000 m3/hr)
Air cooled type pump - SE50, SE80
Simple structure and compact design of the pump
· Low unit cost
· Minimized installation
· Short gas path to discharge (High speed of discharge)
Structure of screw type rotor and one stage
· Higher volume efficiency
· Lower noise and vibration
Low operation cost - Low power consumption
· Small amount of cooling water supply
Low maintenance cost
· More simple structure than the pump with multi-stage
· Minimized repairing time and cost.
Improved pump's life and low maintenance cost
Application
· OLED
· LiPB
· Ultrasonic Cleaning/Plasma Cleaning
· Heat Treatment Furnace
· Electric, Electronics & all Semiconductor Process
Load-lock & transfer chamber pumping
Backing a turbo pump on all processes
CVD, PVD, Etching, Ion implantation etc.
The clean & harsh chemistries used in all semiconductor applications
Vacuum Packaging Process (PDP)
| Guide of Pump Selection | Neovac seires | |||
| Application | Air Evacuation | ∨ | ||
| Load lock/Transfer/Buffer Chamber evacuation | ∨ | |||
| Sputtering Deposition | ∨ | |||
| Ion implantation | ∨ | |||
| Ashing | ∨ | |||
| Etching Process | Metal | ∨ | ||
| Oxide | ∨ | |||
| Nitride | ∨ | |||
| CVD Process | Nitride | ∨ | ||
| Oxide | ∨ | |||
| Nitride | ∨ | |||
| Epitaxial Process | ∨ | |||
| Items | SS120 | SS200 | SS300 | SS600W | |
| Model | Mech, Booster | - | - | - | SSB600 |
| Dry V/P | SS120 | SS200 | SS300 | S120 | |
| Nominal Displacement 60Hz(50Hz),㎥/Hr | 120(100) | 187(155) | 320(267) | 660(568) | |
| Ultimate Pressure (Torr/Pa) | 0.005 | 0.005/0.67 | 0.005/0.67 | 0.0007/0.093 | |
| Rotation 60Hz(50Hz),rpm | 3500(2900) | 3500(2900) | 3500(2900) | 3500(2900) | |
| Noise, dB | <65 | <65 | <65 | <65 | |
| Motor, KW | 4 | 4 | 7.5 | 8 | |
| Power Consumption, KW | 2.5 | 3 | 5 | 3.2 | |
| N2 Purge, sim | Clean | 0 | 0 | 0 | 0 |
| Harsh | 0~50 | 0~50 | 0~50 | 0~50 | |
| Cooling Water, l /min | 2 | 2 | 7 | 3 | |
| Oil, l | 0.5 | 0.5 | 1.6 | 1.5 | |
| Port Size (Suction/Discharge) | NW50/NW40 | NW50/NW40 | NW50/NW40 | ISO100/NW40 | |
| Weight(Pump Only), Kg | 140 | 140 | 300 | 360 | |
| SIZE(L × W × H),mm | - | - | - | 890×390×828 | |
| Items | SS1200W | SS1800W | SS3000W | SS5000W | |
| Model | Mech, Booster | SSB1200 | SSB1800 | SSB3000 | SSB5000 |
| Dry V/P | S120 | SS200 | KDPH800 | KDPH800 | |
| Nominal Displacement 60Hz(50Hz),㎥/Hr | 1200(1000) | 1800(1500) | 3000(2500) | 5000(4166) | |
| Ultimate Pressure (Torr/Pa) | 0.0007/0.093 | 0.0007/0.093 | 0.0007/0.093 | 0.0007/0.093 | |
| Rotation 60Hz(50Hz),rpm | 3500(2900) | 3500(2900) | 3500(3500) | 3500(3500) | |
| Noise, dB | <65 | <65 | <65 | <65 | |
| Motor, KW | 8 | 8 | 15 | 52 | |
| Power Consumption, KW | 3.8 | 4.7 | - | - | |
| N2 Purge, sim | Clean | 0 | 0 | 0 | 0 |
| Harsh | 0~50 | 0~50 | 0~50 | 0~50 | |
| Cooling Water, l /min | 3 | 3.5 | 2.4 | 35 | |
| Oil, l | 1.5 | 2.2 | 2.2 | 10 | |
| Port Size (Suction/Discharge) | ISO100/NW40 | ISO160/NW40 | ISO200/ISO63 | ISO320/ISO80 | |
| Weight(Pump Only), Kg | 390 | 480 | 970 | 2100 | |
| SIZE(L × W × H),mm | 850×390×858 | 940×520×1000 | 1270×590×1120 | 1270×590×1120 | |
