As a pioneer in selective soldering segment, Laserssel has provided customers with unique soldering capabilities solving various problems in thin semiconductor package warpage enhancement, micro-sized LED component reflow / rework in advanced display and component bonding on thermally sensitive substrates and many other challenges that were difficult, if not impossible, in conventional reflow process.
Combined with its extensive knowledge in Laser technology and expertise in process engineering, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling next generation electronic devices that are becoming smaller and thinner.