LB Semicon Inc. was launched in February 2000 and was the first company in Korea to start a business in the flip-chip wafer bumping field with all necessary production facilities established.
Starting with gold bumping for TFT LCD & OLED Display Driver IC (DDI), LB Semicon Inc. has expanded its scope into Solder bumping, Cu pillar bumping, and even Wafer Level Chip Scale Package (WLCSP) by continuously developing its flip-chip bumping technology.
Based on such technological progress, the company has maintained solid partnerships with top semiconductor chip manufacturers both at home and abroad.