PCB and Testing components for Semi conductor IC manufacturer, Test pin, Test socket and more
Memory Test Socket
Using advanced precision injection molding equipment and patented technology, LEENO can provide molded sockets for various package sizes for memory sockets.
Specifications
- Package Type
BGA, TSOP etc.
- Pitch
0.30P~
- Customizing
GPS (Device Alignment System), Floating Type, Hybrid BK Type
Product Series