Information
43 Deokseongsandan 2-ro 50beon-gil, Idong-eup, Cheoin-gu, Yongin-si, Gyeonggi-do, South Korea
+82 31-659-7979
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Overview
- Summary
- Micro2nano is a specialized company developing and producing advanced core components from micro to nano units, including semiconductor inspection probe cards, microneedles, optical communication components, and pressure sensors, utilizing proprietary MEMS technology based on semiconductor processes. The company aims for continuous growth by providing innovative solutions across various industrial sectors.Micro2nano is a specialized company developing and producing advanced core components from micro to nano units, including semiconductor inspection probe cards, microneedles, optical communication components, and pressure sensors, utilizing proprietary MEMS technology based on semiconductor processes. The company aims for continuous growth by providing innovative solutions across various industrial sectors.
- Key Products/Technologies
- **MEMS (Micro-Electro Mechanical Systems) Technology**: An advanced technology company specializing in the production of various products from micro to nano units, leveraging proprietary MEMS technology applied from semiconductor processes. This technology is a core capability for developing diverse applications such as ultra-precision optical communication components, semiconductor inspection probe cards, atomic microscope nano probes, and automotive brake-related pressure sensors.**MEMS (Micro-Electro Mechanical Systems) Technology**: An advanced technology company specializing in the production of various products from micro to nano units, leveraging proprietary MEMS technology applied from semiconductor processes. This technology is a core capability for developing diverse applications such as ultra-precision optical communication components, semiconductor inspection probe cards, atomic microscope nano probes, and automotive brake-related pressure sensors.
- **Probe Card**: A key component for testing the normal operation of semiconductor wafers, connecting semiconductor chips on the wafer with test equipment. Possesses unique Space Transforming technology for transmitting signals from MEMS Probe Tips to the Main PCB. NAND probe cards constitute a significant portion of its revenue, supplied to major domestic and international semiconductor companies like SK Hynix. Recently succeeded in passing the qualification test for SK Hynix HBM EDS (Engineering Die Sort) probe cards, entering the high-value-added product segment.**Probe Card**: A key component for testing the normal operation of semiconductor wafers, connecting semiconductor chips on the wafer with test equipment. Possesses unique Space Transforming technology for transmitting signals from MEMS Probe Tips to the Main PCB. NAND probe cards constitute a significant portion of its revenue, supplied to major domestic and international semiconductor companies like SK Hynix. Recently succeeded in passing the qualification test for SK Hynix HBM EDS (Engineering Die Sort) probe cards, entering the high-value-added product segment.
- **Microneedle**: A micro-sized injection probe, approximately 60㎛, for pain-free drug delivery, serving as a medical device component. Made from high-purity silicon, offering excellent biocompatibility, with a precise pyramidal structure realized through MEMS technology for enhanced skin penetration and stability. Potential for broad application in medical and bio fields, including vaccines, cosmetics, and drug delivery.**Microneedle**: A micro-sized injection probe, approximately 60㎛, for pain-free drug delivery, serving as a medical device component. Made from high-purity silicon, offering excellent biocompatibility, with a precise pyramidal structure realized through MEMS technology for enhanced skin penetration and stability. Potential for broad application in medical and bio fields, including vaccines, cosmetics, and drug delivery.
- **V-Groove**: An ultra-precision component used as a substrate for optical fiber arrays for precise alignment of various fibers in optical waveguide devices. A product utilizing silicon crystal structures, achieving precise core pitch. Capable of mass production using silicon wet etching processes and supports customized designs from 1 to 128 channels, including 250㎛ and 127㎛ pitches.**V-Groove**: An ultra-precision component used as a substrate for optical fiber arrays for precise alignment of various fibers in optical waveguide devices. A product utilizing silicon crystal structures, achieving precise core pitch. Capable of mass production using silicon wet etching processes and supports customized designs from 1 to 128 channels, including 250㎛ and 127㎛ pitches.
- **Pressure Sensor**: A semiconductor chip designed to detect pressure applied to automotive brakes for the operation of ABS, ESC, and TCS stability systems. Features high precision, long-term reliability, miniaturized packaging, and optimization for harsh automotive environments.**Pressure Sensor**: A semiconductor chip designed to detect pressure applied to automotive brakes for the operation of ABS, ESC, and TCS stability systems. Features high precision, long-term reliability, miniaturized packaging, and optimization for harsh automotive environments.
- **Foundry Service**: A service that supports customized process development and manufacturing based on extensive experience and know-how in MEMS and nano process services since 2001. Provides support for prototype production and mass production, meeting customer demands in the semiconductor and sensor sectors.**Foundry Service**: A service that supports customized process development and manufacturing based on extensive experience and know-how in MEMS and nano process services since 2001. Provides support for prototype production and mass production, meeting customer demands in the semiconductor and sensor sectors.
- Core Advantages
- **Proprietary MEMS-based Technology**: Core competency in proprietary MEMS technology derived from semiconductor processes, enabling the development and production of advanced micro- to nano-scale device components. This secures a leading position in a high-barrier technology field.**Proprietary MEMS-based Technology**: Core competency in proprietary MEMS technology derived from semiconductor processes, enabling the development and production of advanced micro- to nano-scale device components. This secures a leading position in a high-barrier technology field.
- **Expertise in High-Precision Micro-Contact Technology**: Specialized in high-precision micro-contact technology for developing and supplying probe cards optimized for testing high-density memory semiconductors such as HBM, DRAM, and NAND. Effective response to complex and advanced semiconductor testing requirements through sophisticated design and process technology.**Expertise in High-Precision Micro-Contact Technology**: Specialized in high-precision micro-contact technology for developing and supplying probe cards optimized for testing high-density memory semiconductors such as HBM, DRAM, and NAND. Effective response to complex and advanced semiconductor testing requirements through sophisticated design and process technology.
- **Vertically Integrated Production and Quality Management System**: Capability to independently perform all processes from R&D to design, manufacturing, and quality control. This system allows for flexible and highly reliable responses to demanding customer requirements.**Vertically Integrated Production and Quality Management System**: Capability to independently perform all processes from R&D to design, manufacturing, and quality control. This system allows for flexible and highly reliable responses to demanding customer requirements.
- **Diversified Product Portfolio and Expanded Application Areas**: Diversification of its product portfolio beyond semiconductor inspection probe cards to include microneedles, V-Grooves, and pressure sensors, applying MEMS technology to various industrial sectors. Securing growth drivers through entry into new markets such as bio, optical communication, and automotive.**Diversified Product Portfolio and Expanded Application Areas**: Diversification of its product portfolio beyond semiconductor inspection probe cards to include microneedles, V-Grooves, and pressure sensors, applying MEMS technology to various industrial sectors. Securing growth drivers through entry into new markets such as bio, optical communication, and automotive.
- **Long-term Partnerships with Major Clients**: Established and maintained cooperative relationships for over 15 years with leading domestic and international semiconductor companies, including SK Hynix. Holds a significant market share in SK Hynix's NAND probe card market, ensuring a stable customer base.**Long-term Partnerships with Major Clients**: Established and maintained cooperative relationships for over 15 years with leading domestic and international semiconductor companies, including SK Hynix. Holds a significant market share in SK Hynix's NAND probe card market, ensuring a stable customer base.
- **Qualification Test Success for HBM EDS Probe Cards**: Successful qualification for HBM EDS probe cards, which demand high-speed interfaces and high-density design, demonstrating technical completeness and reliability. This marks a significant achievement in entering a market previously dominated by a few global companies, strengthening its technological competitiveness.**Qualification Test Success for HBM EDS Probe Cards**: Successful qualification for HBM EDS probe cards, which demand high-speed interfaces and high-density design, demonstrating technical completeness and reliability. This marks a significant achievement in entering a market previously dominated by a few global companies, strengthening its technological competitiveness.
- Target Industrie
- Semiconductor Industry (memory semiconductors, non-memory semiconductors, wafer testing, HBM testing)Semiconductor Industry (memory semiconductors, non-memory semiconductors, wafer testing, HBM testing)
- Medical and Bio Industry (drug delivery systems, vaccines, cosmetics)Medical and Bio Industry (drug delivery systems, vaccines, cosmetics)
- Optical Communication Industry (optical fiber alignment, optical communication modules)Optical Communication Industry (optical fiber alignment, optical communication modules)
- Automotive Industry (pressure sensors for ABS, ESC, TCS systems)Automotive Industry (pressure sensors for ABS, ESC, TCS systems)
- Sensor Industry (development and manufacturing of advanced miniature sensors)Sensor Industry (development and manufacturing of advanced miniature sensors)
- Major Markets
- South Korea, China, Japan, TaiwanSouth Korea, China, Japan, Taiwan
- USAUSA
- Certifications/Patents
- **Patent Holdings**: Holds 37 domestic patents, 3 US patents, and 1 PCT (international) patent (as of January 2023). This is one of the strengths in Probe Card R&D and production.**Patent Holdings**: Holds 37 domestic patents, 3 US patents, and 1 PCT (international) patent (as of January 2023). This is one of the strengths in Probe Card R&D and production.
- **Key Certifications**: Acquired ISO 9001 quality certification, ISO 14001 environmental management system certification, and IATF 16949:2016 automotive quality management system certification. Also holds Venture Company certification, Innovative Business (INNO-biz) certification, Yongin City Excellent Company certification, and confirmation as a Specialized Materials, Parts, and Equipment (Soo-Bu-Jang) company.**Key Certifications**: Acquired ISO 9001 quality certification, ISO 14001 environmental management system certification, and IATF 16949:2016 automotive quality management system certification. Also holds Venture Company certification, Innovative Business (INNO-biz) certification, Yongin City Excellent Company certification, and confirmation as a Specialized Materials, Parts, and Equipment (Soo-Bu-Jang) company.
- **Major Awards**: Awarded the Prime Minister's Award in the Industrial Technology category at NanoKorea 2024. Received commendations for fostering nano-convergence technology talent in 2019, for contributions to venture activation in 2016, and selected for the SK Hynix SHE Consulting 'Competency Improvement' Grand Prize and Best Improvement Case in 2022.**Major Awards**: Awarded the Prime Minister's Award in the Industrial Technology category at NanoKorea 2024. Received commendations for fostering nano-convergence technology talent in 2019, for contributions to venture activation in 2016, and selected for the SK Hynix SHE Consulting 'Competency Improvement' Grand Prize and Best Improvement Case in 2022.
Introduction
Location
43 Deokseongsandan 2-ro 50beon-gil, Idong-eup, Cheoin-gu, Yongin-si, Gyeonggi-do, South Korea
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