Information
+82-43-879-3043
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105, Geumil-ro 965beon-gil, Samseong-myeon, Eumseong-gun, Chungcheongbuk-do, Republic of Korea
Introduction
nepes is a leading-edge provider of Wafer Level Packaging, providing full turnkey solutions that include 8” & 12” Flip-chip bumping and Test nepes provides an extensive range of packaging options such as, WLCSP, FOWLP/PLP/PoP, SiP as well as 2.5D/3D modules without conventional substrates.
Location
105, Geumil-ro 965beon-gil, Samseong-myeon, Eumseong-gun, Chungcheongbuk-do, Republic of Korea