Motivation for Development 
Double-sided curing is done on the substrate in the final process of PCB manufacture. This is a “double-sided, concurrent curing machine” most popular in Samsung**, LG**, Daeduk**, etc. in South Korea, and designed to suit the width and curing and temperature conditions of the product. Temperature at the outlet or opening can be at the level of 30 degrees, and the thickness of the product can be made from 30um to 3.2(5), and the amount of light is 1,500mj/cm to 2,500mj/cm2 (in case of 2 MPM). 

Main Use : For printed circuit boards(PCB) and BGA, and sold mask-manufacturing process. 

Product Features
① This equipment has been developed as equipment to manufacture BGA that is irradiated on the double side, and the uniformity in up-and-down beam patterns should be secured to cure resin while maintaining and matching.
② It is largely divided in two types: rigid PCB type and FPCB type. These are basically the same in appearance and electric/optical/mechanical design and different in the chamber and conveyor system.
③ It processes temperature-sensitive products such as FPC through realization of temperature lowering in the chamber to which various optical filters and a separate cooling system are added. 
④ The irradiation distance is modified to be applied to the BGA products, and UV intensity is independently vertically adjustable, so the equipment is capable of responding to various specifications due to transmission rate and product shape and of monitoring the operational state of equipment at times through various indicators including the warning tower lamp.
⑤ All operations are made on the touch panel screen, and lamp power can be controlled to be best suited through Non-Stage (50 to 100%) adjustment. 

Main Specifications