For: Semiconductors, MEMS, Sensors, Microfluidics, IOT, Packaging With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with a new elite class of production photolithography equipment.

Built on the venerable OAI modular platform, the Series 6000 has topside or backside alignment that is fully automated with sub-micron resolution which delivers performance that is unmatched at any price.

The Aligners have Advanced Beam Optics with better than ±3% uniformity and a throughput of 180 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.

With superb process repeatability, the Series 6000 is the perfect solution for all production enviroments. Choose either top side or optional back side alignment which uses OAI's customized pattern recognition software that is Cognex based. For the total lithography process, the Seriesl 6000 can be integrated seamlessly with cluster tools. OAI's new production mask Aligners are the total package.

BENEFITS
① Fully Automated
② Topside Alignment
③ Optional: Bottomside Alignment
④ DUV to NUV
⑤ Cluster Tool Integration
⑥ Customized Software

SPECIFICATIONS