Product
(16)
FO-WLP : Fan Out Wafer Level Package
-
CoC, CoW : Chip on Chip, Chip on Wafer
-
FCCSP : Flip Chip Chip Scale Package
-
FCBGA : Flip Chip Ball Grid Array
-
FBGA : Fine-pitch Ball Grid Array
-
FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die
-
SIP : System in Package
-
PBGA : Plastic Ball Grid Array
-
QFN : Quad Flat No Leads
-
TSOP : Thin Small Outline Package
-
SOP : Small Outline Package
-
QFP : Quad Flat Package
-
DIP : Dual In-line Package
-
TO-220
Micro SD Card : Micro Secure Digital Card
-
SD Card : Secure Digital Card
-