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Auto Ball Placement System
Model Name
BPS-6200FC
Series
Semiconductor Packaging Equipment
Data
-
Manufacturer information
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SSP

Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more

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Manufacturer
SSP
Brand
-
SKU
36037
Product Name
Auto Ball Placement System
Model Name
BPS-6200FC
Size
-
Weight
-
Product Details

SSP Auto Ball Placement System BPS-6200FC

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Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more
Our company’s philosophy is to provide our customers with highly improved products and specialized service in time. We SSP work hard to develop advanced technology experts through professional training programs and study. We do our best to prove that SSP is the reliable company by maintaining high technology and conducting constant research and development. Since 1996, SSP has been manufacturing semiconductor package equipments which enable easy operation, perfect quality concept, and the service system with speedy action according to customer’s point of view. SSP considers customers as our first priority and this will be the best value now and forever. We will do our best to meet our customer’s technological needs having prospect for the future. We are growing to be the strong company with both high technology and sincere service for customers.
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