A specialized company in MEMS-based uncooled infrared sensors and thermal imaging sensor solutions, possessing the capability to implement miniaturized, low-cost, and low-power sensor solutions critical for the Internet of Things (IoT) era. A technology-leading enterprise aiming for diverse markets, from industrial equipment to consumer products, through the localization of core components and securing price competitiveness via wafer-level vacuum packaging technology.AspecializedcompanyinMEMS-baseduncooledinfraredsensorsandthermalimagingsensorsolutions,possessingthecapabilitytoimplementminiaturized,low-cost,andlow-powersensorsolutionscriticalfortheInternetofThings(IoT)era.Atechnology-leadingenterpriseaimingfordiversemarkets,fromindustrialequipmenttoconsumerproducts,throughthelocalizationofcorecomponentsandsecuringpricecompetitivenessviawafer-levelvacuumpackagingtechnology.
UE S3030-M and UE S4140-EVK sensor modules feature high-sensitivity uncooled microbolometer elements, miniaturized wafer-level packaging, and intelligent noise reduction algorithms.UES3030-MandUES4140-EVKsensormodulesfeaturehigh-sensitivityuncooledmicrobolometerelements,miniaturizedwafer-levelpackaging,andintelligentnoisereductionalgorithms.
Thermal imaging network and multi-cameras offer real-time network monitoring, high-resolution thermal imaging, and intelligent fire/intrusion detection software integration.Thermalimagingnetworkandmulti-camerasofferreal-timenetworkmonitoring,high-resolutionthermalimaging,andintelligentfire/intrusiondetectionsoftwareintegration.
The portable thermal imaging camera model UE HC4 is a pro-grade thermal camera for smartphones, including human and general measurement modes, area/spot temperature measurement, temperature alarm settings, and simultaneous real/thermal imaging capabilities.TheportablethermalimagingcameramodelUEHC4isapro-gradethermalcameraforsmartphones,includinghumanandgeneralmeasurementmodes,area/spottemperaturemeasurement,temperaturealarmsettings,andsimultaneousreal/thermalimagingcapabilities.
Proprietary technologies encompass MEMS design and process know-how, Wafer Level Vacuum Package (WLVP), Vanadium Tungsten Oxide (VWOx) sensing materials, thermal camera HW/SW temperature algorithms, and Read-Out IC technology.ProprietarytechnologiesencompassMEMSdesignandprocessknow-how,WaferLevelVacuumPackage(WLVP),VanadiumTungstenOxide(VWOx)sensingmaterials,thermalcameraHW/SWtemperaturealgorithms,andRead-OutICtechnology.
Comprehensive technological capabilities in MEMS-based uncooled microbolometer far-infrared sensors, including infrared sensing materials, MEMS sensor pixel design, ROIC design, manufacturing processes, and sensor evaluation and testing technologies.ComprehensivetechnologicalcapabilitiesinMEMS-baseduncooledmicrobolometerfar-infraredsensors,includinginfraredsensingmaterials,MEMSsensorpixeldesign,ROICdesign,manufacturingprocesses,andsensorevaluationandtestingtechnologies.
Possession of intellectual property covering the entire process of thermal imaging sensors, from materials, design, and process to wafer-level vacuum packaging and wafer-level image testing.Possessionofintellectualpropertycoveringtheentireprocessofthermalimagingsensors,frommaterials,design,andprocesstowafer-levelvacuumpackagingandwafer-levelimagetesting.
These technological strengths form the foundation for providing ultra-compact, low-power sensor solutions and establishing a strong technological moat in key areas of the 4th Industrial Revolution.Thesetechnologicalstrengthsformthefoundationforprovidingultra-compact,low-powersensorsolutionsandestablishingastrongtechnologicalmoatinkeyareasofthe4thIndustrialRevolution.
Core AdvantagesCoreAdvantages
Securing differentiated competitive advantages in related fields based on unique core technologies.Securingdifferentiatedcompetitiveadvantagesinrelatedfieldsbasedonuniquecoretechnologies.
Achieving high price competitiveness and a rapid technical support system compared to foreign products through the localization of core sensors.Achievinghighpricecompetitivenessandarapidtechnicalsupportsystemcomparedtoforeignproductsthroughthelocalizationofcoresensors.
The Wafer Level Vacuum Packaging (WLVP) technology, first developed and unveiled globally in 2010, is essential for miniaturization, mass production, and cost reduction in the consumer market.TheWaferLevelVacuumPackaging(WLVP)technology,firstdevelopedandunveiledgloballyin2010,isessentialforminiaturization,massproduction,andcostreductionintheconsumermarket.
Specialized design capabilities to produce components optimized for various resolutions and viewing angles required by customers.Specializeddesigncapabilitiestoproducecomponentsoptimizedforvariousresolutionsandviewinganglesrequiredbycustomers.
Provision of superior performance and reliability through the application of high-sensitivity uncooled microbolometer elements and intelligent noise reduction algorithms.Provisionofsuperiorperformanceandreliabilitythroughtheapplicationofhigh-sensitivityuncooledmicrobolometerelementsandintelligentnoisereductionalgorithms.
Unique expertise in Korea with over 15 years of experience and know-how in MEMS-based thermal imaging sensors.UniqueexpertiseinKoreawithover15yearsofexperienceandknow-howinMEMS-basedthermalimagingsensors.
Capability to provide total solutions, including camera hardware/software and temperature algorithm technologies for sensor applications.Capabilitytoprovidetotalsolutions,includingcamerahardware/softwareandtemperaturealgorithmtechnologiesforsensorapplications.
Securing a stable B2B revenue structure through the supply of optical modules to industrial equipment manufacturers and complete thermal imaging network camera solutions.SecuringastableB2Brevenuestructurethroughthesupplyofopticalmodulestoindustrialequipmentmanufacturersandcompletethermalimagingnetworkcamerasolutions.
Target IndustrieTargetIndustrie
IoT sector applications including smart devices, smart building automation, smart human detection, energy management, facial recognition, security, and pre-fire detection systems.IoTsectorapplicationsincludingsmartdevices,smartbuildingautomation,smarthumandetection,energymanagement,facialrecognition,security,andpre-firedetectionsystems.
Automotive sector applications such as night vision, occupant recognition and smart air conditioning, pedestrian detection, and blind spot detection for next-generation vision systems.Automotivesectorapplicationssuchasnightvision,occupantrecognitionandsmartairconditioning,pedestriandetection,andblindspotdetectionfornext-generationvisionsystems.
Industrial sector solutions for safety management, including industrial equipment monitoring and diagnosis, power distribution board overheating prevention, gas leak detection, and pipeline defect prevention.Industrialsectorsolutionsforsafetymanagement,includingindustrialequipmentmonitoringanddiagnosis,powerdistributionboardoverheatingprevention,gasleakdetection,andpipelinedefectprevention.
Healthcare sector applications such as patient monitoring, non-contact thermometers, and elderly temperature observation in silver towns.Healthcaresectorapplicationssuchaspatientmonitoring,non-contactthermometers,andelderlytemperatureobservationinsilvertowns.
Next-generation vision systems and surveillance/diagnosis markets, including autonomous vehicles, drones, robots, and CCTV.Next-generationvisionsystemsandsurveillance/diagnosismarkets,includingautonomousvehicles,drones,robots,andCCTV.
Role as a system integrator for establishing safety management infrastructure in public institutions and large-scale plants.Roleasasystemintegratorforestablishingsafetymanagementinfrastructureinpublicinstitutionsandlarge-scaleplants.
Major MarketsMajorMarkets
South Korea, Japan, ChinaSouthKorea,Japan,China
EuropeEurope
United StatesUnitedStates
Certifications/PatentsCertifications/Patents
Possession of numerous intellectual property rights, including 15 domestic patents, 1 international patent (US/Japan/China/Europe), 2 domestic patent applications, and 3 PCT applications.Possessionofnumerousintellectualpropertyrights,including15domesticpatents,1internationalpatent(US/Japan/China/Europe),2domesticpatentapplications,and3PCTapplications.
Securing IP for the entire process of thermal imaging sensors, from materials, design, and process to wafer-level vacuum packaging and wafer-level image testing.SecuringIPfortheentireprocessofthermalimagingsensors,frommaterials,design,andprocesstowafer-levelvacuumpackagingandwafer-levelimagetesting.
Strengthening technological competitiveness through technology transfer of KIST original patents and exclusive ordinary license rights.StrengtheningtechnologicalcompetitivenessthroughtechnologytransferofKISToriginalpatentsandexclusiveordinarylicenserights.
Establishment of an affiliated research institute, venture company certification, quality management certification (ISO9001:2008), INNO-BIZ company certification, selection as a specialized material and component company, and acquisition of the highest grade (TI-2) in NICE TCB technology evaluation.Establishmentofanaffiliatedresearchinstitute,venturecompanycertification,qualitymanagementcertification(ISO9001:2008),INNO-BIZcompanycertification,selectionasaspecializedmaterialandcomponentcompany,andacquisitionofthehighestgrade(TI-2)inNICETCBtechnologyevaluation.
Various government and institutional certifications, including Industrial Bank of Korea Pioneer Investment Company, Green Technology Certification, Priority Purchase Recommendation for Excellent Inventions, Designation as a Venture Startup Innovation Procurement Product, and Small and Medium Business Corporation Technology Leader Company.Variousgovernmentandinstitutionalcertifications,includingIndustrialBankofKoreaPioneerInvestmentCompany,GreenTechnologyCertification,PriorityPurchaseRecommendationforExcellentInventions,DesignationasaVentureStartupInnovationProcurementProduct,andSmallandMediumBusinessCorporationTechnologyLeaderCompany.
Awarded the 2nd Electronic IT Patent Management Grand Prize in 2012.Awardedthe2ndElectronicITPatentManagementGrandPrizein2012.