Semi conductor postprocessing solution, Semi conductor, FBGA, WLP, MCP
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Since being established in 2002, WINPAC started its package production line in 2004 and expanded to the field testing service as of 2007. Ever since our company has been known for its expertise in semiconductor back-end processing as we offer a total solution for assembly and testing to our valued customers.
50, Cheongganggachang-ro, Baegam-myeon, Cheoin-gu, Yongin-si, Gyeonggi-do, Korea