Highlights:
Small desktop version
Quick and easy conversion to various device packages
Low cost of investment
Test and Programming of tube stacked ICs or similar devices
Customized solution for optimal conveying of shrink packages
Application specific stimulus for test of sensor devices
Package types:
DIP, SIP, ZIP, PLCC, LCC, SOJ, SOIC, TSOP, QSOP, VSOP, SSOP, SOT,TO, MLP, QFN
Technical Data:
Throughput at zero test time up to 3300 UPH (including contact action)
Input capacity 1 tube
Output capacity 3 tubes (3 BIN sort)
Tester interface parallel test (Start testm End of test, 3 BIN input
Dimensions incl. base plate 340 x 500 x 570 mm
(width x depth x height)
max. Weight 14 kg (30 lbs.)
Highlights:
Fast convertible device handler for ambient operation.
Possibility for integration of
- programming
- device marking
- labeling units
Fast changeable conversion kit
For small and large devices
Various contacts and special demand contacts
Stand-alone mobile support with adjustment for slope angle and height
Features:
Easy conversion kit changeover to different device packages in less than 10 minutes
Possibility for integration of programming, device marking and labeling units
Stand-alone mobile support with adjustment for slope angle and height
special contacts, also for fine pich leads, HF, HV, HC
Various contacts (non Kelvin, Kelvin)
Package types:
SO, TSSOP, QSOP, VSOP, SSOP, SOT, SOJ, TO, DIP, SIP, ZIP, PLCC, LCC, MLP, QFN
and others
Highlights:
Fast convertible device handler for ambient operation.
Possibility for integration of
- programming
- device marking
- labeling units
Fast changeable conversion kit
For small and large devices
Various contacts and special demand contacts
Stand-alone mobile support with adjustment for slope angle and height
Features:
Easy conversion kit changeover to different device packages in less than 10 minutes
Possibility for integration of programming, device marking and labeling units
Stand-alone mobile support with adjustment for slope angle and height
special contacts, also for fine pich leads, HF, HV, HC
Various contacts (non Kelvin, Kelvin)
Package types:
SO, TSSOP, QSOP, VSOP, SSOP, SOT, SOJ, TO, DIP, SIP, ZIP, PLCC, LCC, MLP, QFN
and others
Technical Data:
Temperature control range ambient, +30°C to +155°C
Highlights:
Fast convertible device handler for ambient operation.
Possibility for integration of
- programming
- device marking
- labeling units
Fast changeable conversion kit
For small and large devices
Various contacts and special demand contacts
Stand-alone mobile support with adjustment for slope angle and height
Features:
Easy conversion kit changeover to different device packages in less than 10 minutes
Possibility for integration of programming, device marking and labeling units
Stand-alone mobile support with adjustment for slope angle and height
special contacts, also for fine pich leads, HF, HV, HC
Various contacts (non Kelvin, Kelvin)
Cooling without LN2
Package types:
SO, TSSOP, QSOP, VSOP, SSOP, SOT, SOJ, TO, DIP, SIP, ZIP, PLCC, LCC, MLP, QFN
and others
Technical Data:
Temperature control range ambient, -55°C to +155°C