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케이셈테크놀러지
Series2
Die Bonder
Lamination
제품
High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
AD-100
High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
AD-200
High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
AD-300
High performance FO-PLP BONDER
AD-400
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Partners
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0503-5304-1023
041-901-4136
jw.wi@ksemsys.co.kr
충청남도 천안시 동남구 풍세면 남관길 70 406동