CMP Machines Manufacturer
Advantages
Price
Small, easy-to-use, robust
Direct transfer of processes developed on the Pcox200 S to a Pcox20X production machines
Possible and easy evolution of a Pcox200 S module into a Pcox20X machine ensuring long tool life without
obsolescence.
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Using The Pcox 20X range presents a series of modular machines which offers configurations including 2, 3 or 4 polishing modules. The Pcox 200 S is one of these modules used in stand-alone form for process development It offers all the specifications of the production machine : -Complete control by computer and PLC -Automatic loading and unloading of the polishing head -Ten polishing steps -Standard 200 mm -Compatibility 4 “to 8” -Ex-situ and in-situ conditioning -Integrated slurry pump -Unique quick exchange of platen, polishing carriers and conditioning tools. Its structure offers the same productivity specifications as a module included in a Pcox20X machine although with manual loading of the wafer to save space and cost. |
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Specifications
| Rack | |
|---|---|
| Wafer diameter | <= 200 mm |
| Rotation speed | 15 – 150 rpm |
| Back pressure | 0 – 100 kPa |
| Pressing force | 0 – 3000 N |
| Scan amplitude | 0 – maximum |
| Scan speed | 0 – 0.35 m/s |
| Tray | |
| Diameter | 550 mm |
| Rotation speed | 15 – 150 rpm |
| Temperature | 10 – 60°C |
| Abrasive | 0 – 250 ml/min |
| Conditioner | |
| Tool type | brush, disc, diamond ring |
| Tool diameter | 100 – 225 mm |
| Force | 20 – 300 N |
| Rotation speed | 10 – 70 rpm |
| Scan speed | 0 – 0.9 m/s |
| End point | |
| Module prepared for interfacing with a system for detecting the end of attack | DFA2 system from Alpsitec or other system. |
| Power | |
| Head motor | 0.75 kW |
| Platen motor | 2.20 kW |
| Conditioning motor | 0.37 kW |
| Facilities | |
| Voltage | 220V Tri or 400V tri |
| Compressed air | 6 bars |
| Nitrogen | 2 bars |
| DI water | 1 bar |
| Consumption | |
| Electricity | 1 – 2 KWH |
| DI water | 100 L/hour |
| Vaccum | internal vacuum pump |
| Dimensions | |
| Width | 950 mm |
| Depth | 1190 mm |
| Height | 2480 mm |
| Weight | 1000 kg |
| Wafer dimension | 4’’ to 200 mm |
| Retrofit kit | 4″, 5″, 6″ |
| Option | module autoloading cassette 1 |
These characteristics may be modified depending on the evolution of equipment.