CMP Machines Manufacturer
Advantages -Price -2 to 4 polishing modules -Easy to use and robust. The Pcox20X range presents a series of modular machines which offers configurations including 2, 3 or 4 polishing modules and is production oriented. The product characterisics are similar to the Pcox 200S. |
Specifications
Rack | |
---|---|
Wafer diameter | <= 200 mm |
Rotation speed | 15 – 150 rpm |
Back pressure | 0 – 100 kPa |
Pressing force | 0 – 3000 N |
Scan amplitude | 0 – maximum |
Scan speed | 0 – 0.35 m/s |
Tray | |
Diameter | 550 mm |
Rotation speed | 15 – 150 rpm |
Temperature | 10 – 60°C |
Abrasive | 0 – 250 ml/min |
Conditioner | |
Tool type | brush, disc, diamond ring |
Tool diameter | 100 – 225 mm |
Force | 20 – 300 N |
Rotation speed | 10 – 70 rpm |
Scan speed | 0 – 0.9 m/s |
End point | |
Module prepared for interfacing with a system for detecting the end of attack | DFA2 system from Alpsitec or other system. |
Power | |
Head motor | 0.75 kW |
Platen motor | 2.20 kW |
Conditioning motor | 0.37 kW |
Facilities | |
Voltage | 220V Tri or 400V tri |
Compressed air | 6 bars |
Nitrogen | 2 bars |
DI water | 1 bar |
Consumption | |
Electricity | 1 – 2 KWH |
DI water | 100 L/hour |
Vaccum | internal vacuum pump |
Dimensions | |
Width | 950 mm |
Depth | 1190 mm |
Height | 2480 mm |
Weight | 1000 kg |
Wafer dimension | 4’’ to 200 mm |
Retrofit kit | 4″, 5″, 6″ |
Option | module autoloading cassette 1 |