Selex 300 oxide etcher is designed with ACP source that combines ICP with CCP plasma characteristics.
The unique source concept is suitable for dielectric material etch.
With wide process applications such as contact etch, via etch, dual damascene and low-k etch, the tool has been approved in a 300mm customer fab.
Selex 200 & 300 metal etch system features APTC patented ACP source that produces symmetric high density plasma.
The metal etcher has been applied for Al etch & W etch processes since year 2003 in DRAM and Flash applications.
The cluster tool furnishes main etch chambers and PR strip chambers with high throughput design.
Polysilicon and silicon etcher is capable of etching sub-20nm poly related processes including STI, DPT and Gate.
Our poly etcher has been upgraded to provide key process control knobs with tunable dual source coil, tunable ESC and RF pulsing.
The system consists of three main chambers and one strip chamber,?which removes toxic fume exhaust from processed wafers.
