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TSV Etcher
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APTCSemi conductor process equipment manufacturer, Hybrid system, Chamber system products
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APTC
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SKU
29449
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TSV Etcher
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As TSV(Through Silicon Via), which is deep silicon etching, becomes popular, high etch rate and hardware reliability are the key issues. Our system can now etch 150 ~ 300 um depth via holes with 50um CD at the etch rate of 10um/min with the Bosch process. 

APTCSemi conductor process equipment manufacturer, Hybrid system, Chamber system products
APTC was founded with the purpose to produce world-class semiconductor processing equipment. APTC is focused on engineering and technology for plasma-related semiconductor processing equipment. Despite its short history, APTC has made significant progress including 300mm etchers, plasma doping systems, and LED etchers. In light of a multidisciplinary area that requires processing equipment, APTC aims to combine all areas of engineering. Starting with etchers, APTC aspires to be the worldwide leader in semiconductor processing equipment. The semiconductor processing equipment will naturally have a significant impact on related industries such as materials processing, vacuum technology, RF engineering, etc.
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