Laser processing equipment manufacturer, Laser marking M/C for semi conductor, Driller, PCB via hole and more
Laser soldering uses filler material melting below 450℃, which inosculates assembled or adjoining parts through capillary action.
- Generally used in various material soldering in the electronics industry field
- High-speed operation with automatic equipment
This soldering equipment uses 30W ~ 100W Diode laser.
Its multi beam improves the soldering speed, and the coaxial vision changes the soldering position.
It provides soldering solution for vehicle PCB, measuring instrument, semiconductor reflow, camera module and etc..