Laser processing equipment manufacturer, Laser marking M/C for semi conductor, Driller, PCB via hole and more
Laser cutting / drilling processes by melting parent material with the concentrate laser beam.
- Generally used in metal/nonmetal cutting
- Noncontact cutting process
- Possible to improve cutting quality and its surface depending on assist gas
The cutter / driller uses high-power fiber laser (500W~4㎾).
It provides solution for wide depth range of metal sheet such as steel, AL, SUS, Cu, Ti, Mo, ceramic and etc..