DLC coating products manufacturer, DFC coating, Hard coating, Thin film analysis equipment, Scratch tester and more
In case of thin film has compress stress of tensile stress, tester measures deforming rate of the board-thin film complex and calculates the residual stress.
Characteristics of RESIDUAL STRESS TESTER
• Automatic control of X-Y axis
• Compute residual stress by usage of thin film's curvature Stoney formula
• (Able to measure of amorphous state)
• Easy to control
Precautions
• Measuring test: Circuit board needs to use Si-wafer with 250 ± 15㎛ thickness, length better be 10 times compare to width.
• Thickness of thin film has to be slimmer than 1/50 size of circuit board.
Specification of RESIDUAL STRESS TESTER
Range of Curvature | 2m ~ 100m | |
Range of Measurement | 60Mpa ~ 10Gpa | |
Resolution of Measurement | 10Mpa | |
Range of Measurement error | < 10% | |
Length of Maximum Scan | 30mm | |
Stap of Minimum Scan | 0.2mm | |
Thickness of Wafer | 100um ~ 800um | |
Thickness of Coati ng film | 0.05um ~ 10um | |
Scan Stage Stroke | 30mm | |
Scan Stage Resolution | 25um | |
Loading Stage Stroke | 140mm | |
Loading stage Resolution | 0.5mm | |
Speed of Measurement | 0.02mm/s | |
Size of Test Piece | 40mm[length] x 4mm[width] | |
Specification of PSD Sensor | 5um | |
Device Size | 500[W] x 500[D] x 500[H] mm | |
Weight | 30kg | |
Power consumption | 150W |