Wiring Thin Film Coater For TSP
Equipment deposits Wiring Thin Film onto the parts’ surface by incorporating the Sputter & Thermal Heater method and is intended for Pattern Mo-Al-Mo & Phosphor-Bronze Plating of the G1F & G2 method implemented TSP used in Mobile Phones & Tablet PCs.
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Features |
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1 |
High |
User Friendly |
1. Rotative & Orbital Load/Unloading |
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Production Capacity |
1,080ea/1Hr, 4” based |
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2 |
Low |
Temp |
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Operating Cost |
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Coefficient Of Friction |
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Specification |
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Works Space |
L4500*D6500*H2700 |
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Weight |
4.5 Tons |
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Main |
Chamber |
Φ1,600*H1600 |
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Source |
Sputter+ Thermal Heater |
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Work Jig |
Φ125 * 28 Axis |
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Pump |
Diffusion Pump |
20” 1 Set |
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Rotary & Booster Pump |
gxs250 & EH2600 |
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Vacuum Level |
5*10-5torr |
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Option |
Chiller |
20RT |
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Poly Coldp |
100,000L/Sec |
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Comparison |
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Wise-WTF 1600 (Batch Type) |
In Line Type |
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Capa |
Batch Time |
60min |
Long |
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Glass Size |
4” |
7” |
10.1” |
Optimized |
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1 Batch |
1,080 |
320 |
192 |
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Day [22Hr] |
35,640 |
10,560 |
6,336 |
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Month [26Day] |
926,640 |
274,560 |
164,736 |
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Deposition Temp |
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Target |
Rotative & Orbital Magazine 12ea |
Titanium Carrier |
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