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VF-5700
Outer Dimension(mm) | 1250(w) × 3200(D) × 2850(H) |
Heater | High Power LGO Heater ( Standard Inner Size : Φ550mm) |
Flat zone Length(mm) | 500 |
Wafer Size(mm) | 300 |
Batch Size | 50 Wafers |
I/O Port | 2 |
Wafer Transfer | 5 wafers + single wafer |
Controller | Model VSC1000 |
Option | Forced-cooling system, N2 load lock, HOST Communication (GEM300), |
Process | Oxidation, Duffusion, LP CVD, Annealing, Polyimide Curing, Nitriding ,Sintering, alloy |
Applications | Si, SiC, IGBT, Polyimide, Thin Wafer |
VF-5100
Outer Dimension(mm) | 1000(w) x 1850(D) x 3520(H) (8 Inchx150 Wafers) |
Heater | LGO Heater |
Flat zone Length(mm) | 350~960 |
Wafer Size(mm) | 4~8 inch |
Batch Size | 150 Wafers |
I/O Port | 1 |
Number of Cassette Stock | 4~8 |
Wafer Transfer | 5 wafers + single wafer |
Controller | Model VSC1000 |
Option | Forced-cooling system, N2 load lock, HOST Communication (GEM300), |
Process | Oxidation, Duffusion, LP CVD, Annealing, Polyimide Curing, Nitriding ,Sintering, alloy |
Applications | Si, SiC, IGBT, Polyimide, Thin Wafer |
VF-1000
Outer Dimension(mm) | 1500(w) x 1000(D) x 2100(H) (~8 Inch Standard) |
Heater | LGO Heater |
Flat zone Length(mm) | 160-250 |
Wafer Size(mm) | ~12 inch |
Batch Size | 25매 |
Controller | Model 880 |
Option | Forced-cooling system, N2 load lock |
Process | Oxidation, Duffusion, LP CVD, Annealing, Polyimide Curing, Nitriding ,Sintering, alloy |
Applications | Si, SiC, IGBT, Polyimide, Thin Wafer |
VF-4000
Outer Dimension(mm) | 2000(w) x 2000(D) x 4350(H) |
Heater | LGO Heater |
Temperature Range | 200~600℃ |
Glass Size | 1300x1500 |
Batch Size | 25~28 Glasses |
Temperature Uniformity | ≤±3℃ |
Chamber Material | High Quality Quartz |
Controller | Model VSC1000 |
Option | Forced-cooling system, HOST Communication(SECS/GEM) |
Process | Activation, Anneal, PI Cure ( Flexible OLED ) |
Applications | ~ G6 |