UV exposure, UV curling machine, Laminator, UV lamp, UV LED lamp
Motivation for Development
This curing machine is designed to be used in the process for fastening and unfastening wafers in the semiconductor wafer-processing CMP process.
Main Use : For semiconductor wafer-processing process
Product Features
① Allow for free use of various sizes of wafers
② Capable of processing multiple wafers.
③ Permit the processing of light irradiation conditions by channels according to the conditions of wafers
④ No adhesive residues (chips) left so that adhesion after the processing of wafers can be easily removed
⑤ There are variable types of scan and irradiation distance, all of which can be applied to wafers with various specifications. (Mainly 8- and 10-inch wafers)
⑥ This is the semi-automatic batch type which processes products in an independent chamber.
⑦ Realize the out-gas system and cleam chamber by adopting the N2 purge system
⑧ Achieve high-efficiency UV flux and high-level beam uniformity
⑨ Display the status of the system through various indicators
Main Specifications