Semi conductor equipment, Display equipment and Material handling automation equipment manufacturer
Overview
The 300mm single wafer processing equipment that is used for post CMP clean, PR strip, ashingless PR strip and metal removal processes.
Feature
Process Performance
- High Temperature SPM Process over 150℃
- PR Strip, Post CMP Clean, Metal Clean and etc.
Productivity / Hardware
- Contamination Free Clean by NIC Bowl
- H2SO4 Recycle System
- Energy Efficiency Rating : Class 1