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SEMBOND
Model Name
SEMBOND
Series
Semiconductor Equipment
Data
-
Manufacturer information
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System Engineering Mega Solution

Semi conductor equipment, Display equipment and Material handling automation equipment manufacturer

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Manufacturer
System Engineering Mega Solution
Brand
-
SKU
28955
Product Name
SEMBOND
Model Name
SEMBOND
Size
-
Weight
-
Product Details

Overview

This machine is to attach chips on leadframes/PCBs at high speed.

 

Feature

Thin die handling without any die crack

- Using specialized patent air ejector
- Handling 25↑㎛ die thickness

High productivity and excellent accuracy

- 2-step bonding for thin & large size die
- Placement accuracy : ±15㎛@3σ (with under vision)
- 4M vision installation (substrate, under vision)
- High accurate dispenser unit

System Engineering Mega Solution
Semi conductor equipment, Display equipment and Material handling automation equipment manufacturer
SEMES, Korea’s leading semiconductor and display manufacturing equipment company, celebrates its 22nd anniversary this year. Back in 1993, the domestic semiconductor equipment industry was almost non-existent. Seeing an opportunity, SEMES focused on developing differentiated core semiconductor equipment technologies, which has matured us to compete in the global market. Thanks to our dedication to develop distinctive technological skills and manufacturing competitiveness, our goal now is becoming the first Korean company within the global top 5 of this industry. In addition, we have continued to create efficient and comfortable working environments based on a compliance management culture, which ensures the fairness and transparency of our business activities. Once again, I would like to thank everyone who has supported us throughout the years of business. In the future, SEMES will continue to focus on improving the quality of our products and services for our customers.
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