Semi conductor equipment, Display equipment and Material handling automation equipment manufacturer
Overview
This machine is to attach chips on leadframes/PCBs at high speed.
Feature
Thin die handling without any die crack
- Using specialized patent air ejector
- Handling 25↑㎛ die thickness
High productivity and excellent accuracy
- 2-step bonding for thin & large size die
- Placement accuracy : ±15㎛@3σ (with under vision)
- 4M vision installation (substrate, under vision)
- High accurate dispenser unit