Semi conductor equipment, Display equipment and Material handling automation equipment manufacturer
Overview
This machine is to test device and IC module by connecting automatically with external test equipment.
Feature
Direct Hot & Cold Temp Test
- Each Socket Active Thermal Control(High Accuracy)
- Temperature Stabilization Time within 10minutes
- Optimized Direct Cold Temperature Testing(-25℃ Continuous for 30days)
Excellent Test Efficiency Increase
- Loading/Unloading Time Minimize
- Direct Loading/Unloading System (No Buffer)
- Jam Rate < 1/150,000 (High Accuracy Pick & Place Head 100㎛↓)
- Unfilled C-Tray Quick Recognize by 3D Inspection Vision(Loading Time Minimize)
- Unload BIN Sorting Time Minimize by Four Head
- High Speed & High Accuracy Pick & Place System