Overvie
An evaporator uses an electric resistance heater or high-energy beam to melt material
and to raise its vapor pressure to a useful range. This process takes place in a high
vacuum state to allow the vapor to reach the substrate without reacting with or
scattering against other gas-phase atoms in the chamber while reducing the
incorporation of impurities from the residual gas in the vacuum chamber. The KVE Series
evaporation systems are capable of fabricating multi-layer thin films by applying this
co-deposition process.
≻ Excellent Thickness Uniformity
The KVE Series IBAD E-Beam Evaporator System provide excellent thickness uniformity of
resultant films. if you deposit the thin film under same conditions, you will get a thin films of
same characteristics.
≻ Assist the deposition by using ion beam
The systems have the E-beam unit and Ion beam unit. Ion beam unit assists to deposit the
thin film of high density.
≻ Always maintain high vacuum degree in process
The systems have a process chamber and a loadlock chamber(option). Loadlock
chamber(option) is used for sample loading. So process chamber is always maintained high
vacuum state.
Process Chamber | Stainless steel |
Vacuum Pumping Station | Cryo, TMP |
Loadlock Chamber | Optional item |
Substrate Unit | Rotation / Heating / Cooling |
Sample Size | 4inch ~ |
Process pressure | < 5.0E-4Torr |
Vacuum Gauge Controller | ATM ~ 1.0E-10Torr |
Power Supply Unit | 6kW, 8kW, 10kW |
Crucible Size | 4cc, 7cc, 15cc, 25cc |
Pocket Number | Single, 4,6 |
Film Thickness Uniformity | < ±5% |
Ultimate Pressure | < 5.0E-7Torr |
System Control | PC auto / PLC Semi-auto |