Tool for real-time thermal simulation of printed circuit boards

PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation, you will obtain a simulation result without stress through the tool's easy and quick operation in 2D. You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.

Useful applications of PICLS

• Troubleshooting thermal issues of current products
• Examining thermal interferences of part layouts
• Consider heat release changes depending on a wiring pattern (coverage ratio)Examine the arrangement of thermal vias (e.g. location, number)
• Examine the arrangement of thermal vias (e.g. location, number)
• Examine the performance of a heat sink
• Examine the size of a PCB
• Examine the number of layers and the thickness of copper foil
• Consider natural/forced air cooling
• Consider radiant heat
• Considering heatsinks (number of fins, size
• Examining heat dissipation performances by connection to enclosure
• Considering PCB mounting environment

Software Features

External file interface

External file interface

You can import IDF 3.0 and Gerber data

Consideration of simple enclosure

Consideration of simple enclosure

You can consider heat dissipation by connection to enclosure

Heatsink

Heatsink

You can allocate and display parts such as plate fins and heat dissipation plates

Library

Library

You can register and reuse created parts to the library

Cutting out a PCB

Cutting out a PCB

Create a PCB of arbitrary shape by cutting out

Preview

Preview

Check the layout of components in 3D

Setting wiring pattern coverage ratio

Setting wiring pattern coverage ratio

Specify the area by rectangle and polygon

Placing thermal vias

Placing thermal vias

Specify through hole and IVH

Specify filled via

Setting mounting environment

Setting mounting environment

Mount horizontally/vertically

Consider forced air cooling and radiation

Displaying each layer

Displaying each layer

Check each layer by selecting a focused layer

Real-time display

Real-time display

Check component translation in real time

Report output

Report output

Output analysis results as reports

Alert function

Alert function

You can check parts whose temperature is higher than threshold

Linking with thermo-fluid analysis

Linking with thermo-fluid analysis

Output CAB file for scSTREAM or HeatDesigner