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제조사 / 판매자 | (주)에스에프에이반도체[바로가기] |
---|---|
연락처 | 041-520-6400 |
브랜드 | - |
제품코드 | 35728 (제품 정보 수정 및 삭제 요청시 필요) |
제품명 | Chip on Chip, Chip on Wafer |
모델명 | - |
사이즈 | - |
중량 | - |
주의사항 | 아래는 참고용 정보이므로 세부 조건은 반드시 제조사/판매자에게 문의 바랍니다. |
Description
ㆍEfficient Integration : Mother and Daughter communicate efficiently at faster speed, lower inductance, and lower electrical resistance, ideally suited for high speed signal applications, e.g. Si photonics
ㆍMulti Die Capability : Mix of devices can be attached to create fully functional blocks, e.g. attaching a laser to Si photonics chip set creates the platform for an optical transceiver
ㆍSupport Legacy : Once sawn, the chip stack can be assembled into a various types of packages e.g. QSFP, QFN, fcCSP, PBGA, etc.
ㆍMultiple Structures : For example CoW POSSUMTM, CoW+WB, etc.
ㆍObjective
ㆍTo develop SFA SEMICON internal TV for CoC / CoS / CoW process (development) SFA SEMICON qualification
ㆍTo attest and document SFA SEMICON CoC/CoW Design Rule
ㆍTo attest the thermal, electrical, and mechanical aspects of the CoC/CoW design
Application
ㆍMobile Phone, HDTV, Camcoder, Wireless Home Appliances, Sensor, Etc
ㆍTouch screen controllers / Antenna
ㆍPower amplifiers
ㆍModem IC, Wi-Fi & Bluetoos, RFIC , PMIC
ㆍApplication processor
Feature
ㆍAll standard Cu pillar & solder bump
ㆍFine pitch Cu pillar & u-bump
ㆍNo general under-fill material
ㆍPassivation barrier type
ㆍNSOP(Non Solder on Pad) type