Assembly and Test, Bumping, 주문형, 포장 반도체 생산, 조립, 검사, 임가공, 화상이미지 전송 칩 제작
Description
SFA SEMICON’s Quad Flat Pack (QFP) is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The QFP is targeted at cost sensitive applications while providing a high degree of thermal and electrical performance. Offered in a wide range of body sizes and pin counts, the QFP provides designers with the flexibility and convenience of meeting their packaging needs for a large variety of device designs.
Application
ㆍProcessor, Controller, DSP, ASIC
ㆍVideo-DAC, PC Chip-Sets
ㆍGate Array
ㆍLogic, Multimedia
ㆍHome Appliances,
ㆍCommercial Commodity
ㆍAutomotive
Feature
ㆍJEDEC Standard compliance
ㆍDie stack Applicable
ㆍGreen materials (Pb-free / RoHS compliance)
ㆍLead pitch ≥ 0.65mm