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제조사 / 판매자 | (주)에스에프에이반도체[바로가기] |
---|---|
연락처 | 041-520-6400 |
브랜드 | - |
제품코드 | 35729 (제품 정보 수정 및 삭제 요청시 필요) |
제품명 | Flip Chip Chip Scale Package |
모델명 | - |
사이즈 | - |
중량 | - |
주의사항 | 아래는 참고용 정보이므로 세부 조건은 반드시 제조사/판매자에게 문의 바랍니다. |
Description
The fcCSP package is the main platform in flip Chip package family, which includes bare die type, Molded (CUF,MUF) types, SiP types, Hybrid (fcSCSP) types and a package sub-system meeting the standard BGA footprint that contains multiple components within the same package (MCM fcCSP). Options also include configurations with thin core, Pb-free and Cu Pillar bump and process method (Mass reflow, TCNCP). The Flip chip CSP packages are suitable for low lead count, high frequency, high performance, and portable products such as performance memory, RFICs, and DSPs.
Application
High End & Low End Package
ㆍAutomotive
ㆍTelecommunication
ㆍComputer
ㆍConsumer
Feature
ㆍBump pitch : Min.130um (Solder bump)
ㆍCu Pillar (TCNCP ≤ 50um / Mass Reflow ≤ 130um)
ㆍDie size : 0.8~12.5mm
ㆍPackage size : 3~19mm