제조사 / 판매자 | (주)에스에프에이반도체[바로가기] |
---|---|
연락처 | 041-520-6400 |
브랜드 | - |
제품코드 | 35731 (제품 정보 수정 및 삭제 요청시 필요) |
제품명 | Fine-pitch Ball Grid Array |
모델명 | - |
사이즈 | - |
중량 | - |
주의사항 | 아래는 참고용 정보이므로 세부 조건은 반드시 제조사/판매자에게 문의 바랍니다. |
Description
FBGA packages have been assembled for years in SFA SEMICON . SFA SEMICON 's experienced design group provides the best package structure design and cost-effective material choices to achieve low profile, small form factor, high reliability and high-quality electrical/ thermal performance for FBGA. BGA technology was first introduced as a solution to problems associated with the increasingly high lead counts required for advanced semiconductors used in applications such as portable computers and wireless telecommunications. As the number of leads surrounding the integrated circuits increased, high lead count packages experienced significant electrical shorting problems. BGA technology solved this problem by effectively creating leads on the bottom surface of the package in the form of small bumps or solder balls.
Application
ㆍHand-held consumer products
ㆍComputing platforms, Networking
ㆍWireless Communications devices
ㆍPersonal Digital Asistants
Feature
ㆍFace-up/Face-down
ㆍJEDEC Standard compliance
ㆍMCP / SiP / Flip chip
ㆍGreen materials (Pb-free / RoHS compliance)
ㆍBall pitch ≥ 0.40mm