제조사 / 판매자 | (주)에스에프에이반도체[바로가기] |
---|---|
연락처 | 041-520-6400 |
브랜드 | - |
제품코드 | 35733 (제품 정보 수정 및 삭제 요청시 필요) |
제품명 | System in Package |
모델명 | - |
사이즈 | - |
중량 | - |
주의사항 | 아래는 참고용 정보이므로 세부 조건은 반드시 제조사/판매자에게 문의 바랍니다. |
Description
SIP package containing combination of one or more multifunctional Ics with heterogeneous interconnection Including passive components and MEMS/Sensor assembled into a single package EMI shielding with sputtering and plating. Any combination of one or more integrated circuit(s) of different functionalities with various form and factors passive components and/or MEMS assembled into a single package. Getting all or part of the functions of an electronic system on the standard PCB board for a moniturization Achieving electrical/thermal performance enhancement purposes
Application
ㆍPower amplifiers, Antenna switches/Frontend module & transceiver, Connectivity module, MEMS integration with ASIC, Sensory module, automotive, 3G/4G model, Solid-state storage devices(SSD)
Feature
ㆍPassive Component (≥ 01005)
ㆍSAW,BAW filter, X-tal, Oscillator, Antenna
ㆍEPS (Embedded Passive Substrate)
ㆍEAD (Embedded Active Device)
ㆍCore & Coreless Substrate
ㆍMold Grinding / Double Molding
ㆍShielding